WL BGA Reballing Stencil Kit with Black Positioning Mold A10 CPU for iPhone 7/7Plus (Upper)

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WL BGA Reballing Stencil Kit with Black Positioning Mold A10 CPU for iPhone 7/7Plus (Upper)

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Estimated time of receiving your package： 3~6 days

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Description

• WL BGA Reballing Stencil kit for iPhone A9 A10 A11 A12 A13 A14CPU soldering.

• With fixed plate (black positioning mold), easy to use and more accurate CPU IC soldering position.

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