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AMAOE 6 In 1 BGA Reballing Stencil For iPhone 11-13 Series
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Estimated time of receiving your package: 3~6 days
Description
• These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
• Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
• High success rate of planting tin, the solder balls can be formed once when you are proficient.
• Simple and convenient to use.
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